Engisol with partner ATP Packaging on ProSweets Cologne 2024
The new year has only just started and another interesting trade fair in our field of experise is already approaching.
From 28-31 January, our partner ATP Engineering & Packaging will have a stand at the meeting place for the confectionery and snack industry: the ISM & ProSweets fair in Cologne.
We will be happy to welcome you at stand 10.1 F028 to discuss your project or simply to catch up on the latest developments in process- and packaging technology.
Would you like to receive a free entry ticket? Get in touch with us and and we will arrange it for you.
See you soon in Cologne!
#Engisol # Packagingautomation #Processtechnology #Sweets and #snacks